Bank of America, Blackstone, Citi and Morgan Stanley announced a $63 billion financing package on Monday, October 26 to buy Broadcom AI chips and networking gear for Anthropic, in one of the largest debt deals tied to the AI buildout. A newly formed special-purpose vehicle will purchase Broadcom XPU accelerators and networking equipment and lease them to Anthropic, with deliveries expected to begin in 2027.

The banks are arranging about $43.5 billion of first-lien financing, roughly 69% of the total, according to Reuters, while Blackstone provides the committed portion of the second-lien financing. Broadcom is providing residual-value support equal to the first-lien portion, effectively a significant guarantee for lenders, and CEO Hock Tan said the deal 'validates that there is capital available to finance such growth.'

Follow-up reporting on October 28 said the banks are preparing to market up to $21 billion of investment-grade bonds in early 2027 as part of the package. The announcement landed the same day Anthropic publicly filed its S-1 for a Nasdaq IPO.